super bright tower type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-LVG11241 rev. : a date : 16 - may - 2005 LVG11241
page 1/4 part no. LVG11241 package dimensions ligitek electronics co.,ltd. property of ligitek only directivity radiation note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. r1.7 1.5max 2.54typ 1.0min 25.0min 3.0 1.6 ?? 0.5 typ 2.4 3.3 1.8 100% 50% 75% 100% 25% 25% 0 75% 50% -60 x -30 x 60 x 0 x 30 x
ligitek electronics co.,ltd. property of ligitek only unit mw g a ma ma vg ratings symbol 30 120 10 100 i f i fp ir pd page 2/4 parameter power dissipation reverse current @5v peak forward current duty 1/10@10khz forward current part no. LVG11241 absolute maximum ratings at ta=25 j j j -40 ~ +85 t opr tstg tsol max 260 j for 5 sec max (2mm from body) -40 ~ +100 20 typ. min. 160 90 max. 2.6 30 lens 565 spectral halfwidth ??f nm forward voltage @20ma(v) viewing angle 2 c 1/2 (deg) luminous intensity @20ma(mcd) peak wave length f pnm soldering temperature storage temperature operating temperature emitted green part no LVG11241 material gap note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. typical electrical & optical characteristics (ta=25 j ) green transparent color min. 1.7
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 vg chip 3.5 page 3/4 part no. LVG11241
reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 4/4 description test item operating life test low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) test condition this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only part no. LVG11241 reliability test: mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs high temperature high humidity test thermal shock test solderability test solder resistance test 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
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